国家/地区 中国（4）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C08G（4） C09D（3）
IPC C08G059/62（4）
发明人 YANG J（2）
公开年 2019（4）
申请年 2019（3） 
专利权人

Graphene microsphere/epoxy resin composite material has hexagonal honeycomb structure, and includes graphene microspheres, epoxy resin and curing agent.

ZENG X, LI C, SUN R, ME Y

Preparing solvent-free epoxy coating containing silicon nitride-containing graphene oxide composite powder involves forming modified silicon nitride, adding silicon nitride to mixed solution of absolute ethanol, silane coupling agent.

WEI M, YAO J, YE T, LI B

Graphene solvent-free epoxy resin static conductive floor coating topcoat comprises graphene-containing epoxy resin containing e.g. S400 graphene, SN4745 dispersant and SN3781 dispersant, and alicyclic amine curing agent.

YANG J, SHEN X, WU J, SHI H, WU Y, YANG C

Powder coating comprises E-12 epoxy resin, graphene-modified phenolic resin curing agent, barium sulfate, mica powder, degassing wax, leveling agent, wetting agent and pigment.

HUANG W, YANG F, LEI G, LIN L, ZOU L, HUANG X, SU J, YANG J, CHEN G, CHEN J, XUE J