国家/地区 中国（71） 世界知识产权组织（13） 美国（9） 台湾（7） 韩国（5） 日本（4） 澳大利亚（2） 欧洲专利局（EPO）（2）
IPC部 C（92）
IPC大类 C08（92）
IPC小类 C08K（92）
IPC C08K003/04（92）
发明人 LI Z（6） LIU Y（5） WU W（4）
HU J（3） HUANG Y（3） LIU C（3）
LIU W（3） PAN Z（3） WANG L（3）
WANG X（3） XIE X（3） ZHANG J（3）
ZHANG X（3） ZHAO L（3） ZHAO Q（3）
公开年 2022（92）
申请年 2022（46）  2021（32）  2020（14） 
专利权人 CHINA PETROL.（6） SINOPEC BEIJ.（4） ANHUI AEROSP.（3） HANGZHOU FUX.（3）
E INK CALIFO.（2） EINK CORP（2） ELEMENT CO L.（2） L P PROPERT.（2）
LUOYANG HIGH.（2） LUOYANG JIAN.（2） NISSAN MOTOR.（2） SAUDI ARABIA.（2）
UNIV ALFAISA.（2） UNIV ANHUI（2） UNIV EAST CH.（2） UNIV QINGDAO.（2）

Thermally conductive film for heat dissipation structure, is formed by arranging binder and scale-like carbon materials formed by graphene layers, and making portion(s) of minor axis of binder and minor axes of spaces formed by carbon materials and binder smaller than minor axis of carbon materials.

NAITO T, TSUKADA Y, KENEKO T, YAJIMA A, SHIRATORI K

Heat conductive film used for head-up display, is configured by disposing scale-like carbon material formed by graphene layers such that adjacent scale-like carbon materials contact each other, and such that major axis of scale-like carbon material is oriented in surface direction of film.

KANEKO T, NAITO T, TSUKADA Y, YAJIMA A, SHIRATORI K

Thermally conductive, electrically insulating film used in electronic products and devices, comprises thermoplastic resin, and thermally conductive filler comprising thermally conductive carbon-based filler, thermally conductive metal oxide or hydroxide filler and thermally conductive ceramic filler.

MENG F

Flexible heat-conducting pad comprises liquid metal, solid heat-conducting filler and polymer, and is prepared by pouring liquid metal int polymer, stirring under air environment, dispersing liquid metal uniformly in polymer, and adding solid heat conducting filler into polymer.

CAO B, ZHANG X

Folding, bending and stretching flexible high heat conducting film useful in chips, comprises graphene-based materials, acrylate group, film-forming auxiliary agent and heat-conducting filling material comprising graphene oxide, aluminum nitride or boron nitride or aluminum nitride and boron nitride.

ZHAO L, ZHANG L

Graphene-ceramic heat dissipation material with improved electrical insulation and resin miscibility comprises first dispersion solution is dispersed and second dispersion solution in which ceramic heat-dissipating filler is pulverized.

KYOUNGJEONGBAE, CHO J I, YANG H J, SONG H, SU Y C

Producing graphene-ceramic heat dissipation material with improved electrical insulation and resin miscibility, comprises preparing first dispersion solution by dispersing graphene interlayer material in aqueous solvent.

KYOUNGJEONGBAE, SU Y C

Preparing high thermal conductivity insulating silica gel, comprises e.g. coating liquid silica gel on both sides of layer of fluorinated graphene membrane, coating liquid silica gel on another layer of fluorinated graphene membrane and curing.

PAN Z, ZHOU M

Dispersant used in composition for forming conductive material slurry, comprises copolymer comprising an acrylate structural unit, vinyl-based structural unit, and acrylamide structural unit.

AKITO I, YUTARO K, KYOICHI S, IBI A, KINOSHITA Y, SHIROTA K

Preparation of modified super absorbent resin (SAP) high-efficiency phase change energy storage material involves heating and stirring distilled water and SAP matrix material made of e.g. high molecular water-absorbent resin, leaving still, drying, and loading with composite hydrated inorganic salt.

WU W, DOU J, RUAN Y, XIE R, YU S, XIE X, GUAN G, CHEN H, TAO X, ZHAO Z, WU P, LI Y