国家/地区 美国（5）
IPC部 C（5）
IPC大类 C08（5）
IPC小类 C08K（5） B29C（3） C08G（3）
C08L（3） C09K（2） E21B（2）
IPC C08K003/11（5）
发明人 ALMOHSIN A（2） ALSHARAEH E（2） BATAWEEL M A（2）
IGUCHI H（2） KASHIWAGI T（2） TSUTSUMI Y（2）
公开年 2021（3） 2022（2）
申请年 2020（2） 
专利权人 SAUDI ARABIA.（2） SHINETSU CHE.（2） UNIV ALFAISA.（2）

Producing maleimide resin film used in flexible printed-wiring boards, involves applying maleimide composition in fluid form to form shape of film, and volatilizing organic solvent from the maleimide composition to obtain the maleimide resin film which is solid and uncured resin film.

KASHIWAGI T, TSUTSUMI Y, IGUCHI H

Forming barrier that is used for eliminating or reducing unwanted production of water in subterranean formation, involves injecting polymer-sand nanocomposite into one or more water producing fractures in subterranean formation.

BATAWEEL M A, ALSHARAEH E, ALMOHSIN A

Preparing polymer-sand nanocomposite comprises applying surface polymerization to surface of sand particles by combining polymerization initiator dissolved in solvent with the sand particles to form precursor sand mixture.

BATAWEEL M A, ALSHARAEH E, ALMOHSIN A

Additively manufacturing silicone elastomer article by applying additive manufacturing material on substrate and forming layer by addition-crosslinking electro-conductive silicone composition containing e.g., organopolysiloxane and catalyst.

YUE Y, JIA L

Maleimide resin film used in maleimide resin composition and as adhesive resin film having low dielectric property, comprises maleimide, (meth)acrylate, inorganic particles with respect to whole resin film and curing catalyst.

IGUCHI H, TSUTSUMI Y, KASHIWAGI T, DI J