国家/地区 中国（4） 韩国（2）
IPC部 C（5） H（2）
IPC大类 C08（5）
IPC小类 C08L（5）
IPC C08L063/00（5）
发明人
公开年 2022（3）
申请年 2021（5）
专利权人

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Preparing thermally conductive adhesive used in power components involves mixing the matrix resin with the sheet-like thermally conductive filler, acoustic cavitation treatment and negative pressure treatment are carried out to obtain a rubber compound.

WANG B, LIU F, PAN H, XU W

Electroconductive composition used as interconnection material, contains resin component containing functionalized polybutadiene, electroconductive filler, curative, core-shell rubber toughener, epoxy reactive diluents and curing agent.

ESTRUGA ORTIGA M, HENCKENS A, ESTRUGA O M, ESTRUGAORTIGAMARQUE

Wave absorbing glue film comprises wave absorbing layer one or two sides set with reinforcing layer outer side set with adhesive film layer outer side set with backing and absorbing layer film formed by mixing wave absorbing material and resin matrix.

ZHAO H, DU P, LI Y, LV T, LI M

Lignin derivative-based phosphorus-containing epoxy resin used for forming composite material for flame retardant materials, coatings, microelectronic packaging materials, and adhesives, comprises structures.

YANG W, DING H, MA P, XU P