国家/地区 中国（5）
IPC部 B（5）
IPC大类 B32（5）
IPC小类 B32B（5）
IPC C08L063/00（5）
发明人 CHAI S（2） SU X（2）
公开年 2014（5）
申请年 2013（4） 
专利权人 GUANGDONG SH.（2）

Preparation of graphene prepreg involves interposing graphene powder between release papers, pressing resultant product, peeling graphene sheet and adhering graphene sheet with semi-cured epoxy resin composite film.

ZENG Y, CHENG H, YING Z, REN W, WANG H, FANG M

Forming a graphene-reinforced polymer matrix composite useful in an aircraft, comprises distributing graphite microparticles into molten thermoplastic polymer phase, and applying succession of shear strain events to molten polymer phase.

NOSKER T, LYNCH J, HENDRIX J, KEAR B, CHIU G, TSE S, HENDRIKS J, XIE S, ZHAO G

Thermosetting resin composition for pre-peg used for laminate and printed circuit board comprises thermosetting resin and inorganic filler in which inorganic filler is oxidized graphene or graphene coated treatment.

CHAI S, SU X

Graphene polymer sheet consists of reinforcing material for use in military, aircraft and ship applications, and graphene film-forming resin comprising graphene and resin composition, in mass ratio of preset range.

CENG M, CENG S, YANG J

Prepreg for laminate used for printed circuit board comprises reinforcing material which is impregnated by thermosetting resin composition and dried in which reinforced material is graphene oxide or graphene subjected to coating process.

SU X, CHAI S