国家/地区 美国（2）
IPC部 C（3） B（2）
IPC大类 C08（3）
IPC小类 C08K（3） C08L（3） B82Y（2）
IPC C08K003/04（3）
发明人
公开年 2012（3）
申请年 2012（3）
专利权人

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S

Product, useful as a polymer system, comprises a shape memory polymer material, and a graphene material incorporated into the shape memory polymer material to form the polymer system.

XIAO X, XIE T, CHENG Y T

Manufacture of silica nanoparticle-grafted graphene oxide-modified epoxy resin condensate, involves adding silica nanoparticle-grafted graphene oxide to epoxy resin substrate, decompressing, adding curing agent, curing and molding.

LEE S, LING R, LIU K, LU S, QI B, XU X