国家/地区 美国（3） 日本（2） 韩国（2）
IPC部 B（3）
IPC大类 C08（3）
IPC小类 C08K（3） C08L（3） B82Y（2）
C08G（2）
IPC C08K003/04（3）
发明人
公开年 2012（3）
申请年 2012（2） 
专利权人

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S

Product, useful as a polymer system, comprises a shape memory polymer material, and a graphene material incorporated into the shape memory polymer material to form the polymer system.

XIAO X, XIE T, CHENG Y T

Polymer resin composition useful for manufacturing an insulating film for manufacture of a build-up multi-layered printed circuit board, comprises polymer resins, and graphene for linking the polymer resins with larger attraction.

LEE K S, HONG S S, LIM H H, LEE H Y, CHO J C, KYU S L, SANG S H, HYUN H L, HWA Y L, JAE C C, HONG S, LEE H, LEE K, LIN H, JO J, LIM H, CHO J