国家/地区 中国（3）
IPC部 C（3）
IPC大类 C08（3）
IPC小类 C08K（3） C08L（3）
IPC C08L063/00（3）
发明人 CHEN C（3）
公开年 2021（2）
申请年 2021（3）
专利权人 UNIV JILIN（2）

Preparing halogen-free low-dielectric compatible high-frequency FR4 copper-clad plate comprises using glue components comprising resins, coupling agents, catalysts, fillers and solvents comprising dimethylbenzene and cyclohexanone.

JIANG D, QIN W, FU J, LIU J, ZHENG B, LUAN H, CHEN C, WANG L

Preparing organic resin composite material with 3-dimentional polyimide as thermally conductive framework comprises e.g. mixing thermally conductive filler, aromatic dianhydride and mixed solvent to perform esterification reaction.

ZHAO X, ZHAO J, WANG C, WANG D, ZHOU H, CHEN C

Preparing organic resin composite material with three-dimensional (3D) polyimide as thermally conductive skeleton by mixing aromatic diamine, aromatic dianhydride and organic solvent to perform polymerization reaction, and vacuum degassing.

ZHAO X, ZHAO J, CONG B, WANG D, ZHOU H, CHEN C