国家/地区 中国（6）
IPC部 C（6） H（2）
IPC大类 C08（6）
IPC小类 C08L（6） C08K（5） C08J（4）
C09K（3） H05K（2）
IPC C08L079/08（6）
发明人 DING P（5） SHI L（4） SONG N（3）
LI X（2） XU T（2）
公开年 2020（2） 2022（2）
申请年 2022（2） 
专利权人 UNIV SHANGHAI（6）

Preparing high thermal conductivity electromagnetic shielding polyimide co-carbonized carbon fiber complex material useful in military, comprises e.g. preparing modified polyamic acid spinning fiber felt, immersing in high-performance resin, and post-processing.

LI X, DING P

Preparing three-dimensional resin-based carbon fiber composite material useful in aerospace, comprises soaking three-dimensional carbon fiber multi-scale reinforcement in thermoplastic resin and forming continuous micro-network in XYZ three-dimensional direction under micro and multiscale.

SHI L, DING P, LI X, XU T

Conductive composite film useful for flexible and transparent detection comprises flexible substrate e.g. polyethylene terephthalate layer, and composite conductive layer e.g. nano silver wire and poly(3,4-ethylenedioxythiophene).

LI Y, LIU L, ZHOU J

Thermally conductive graphene-polymer material composite film comprises multilayer composite film comprising graphene, nanocellulose, and thermoplastic polymer material.

DING P, CUI S, SONG N, SHI L

Composite material useful for automobiles, computers and LED heat dissipation comprises 3D carbon fiber graphene aerogel and polymer resin.

DING P, XU T, SONG N, SHI L

Heat-conducting special polymer material comprises thermosetting polyimide resin or thermoplastic resin and graphene/boron nitride load nano silver.

DING P, SHI L, JIANG F, SONG N