国家/地区 中国（3）
IPC部 C（3）
IPC大类 C08（3）
IPC小类 C08J（3） C08K（3） C08L（3）
C08G（2） C09K（2）
IPC C08K003/04（3）
发明人 ZHOU H（3）
公开年 2023（3）
申请年 2023（3） 
专利权人 UNIV JILIN（2）

Polyimide resin useful in aerospace, electronic appliance, military equipment field, automobile, and communication, comprises carbon nanotube, nitride fine powder, modified kaolin, copper fluorosilicate, and graphene and polyimide resin.

ZHOU Z, WU B, ZHOU H

Preparing three dimensional thermally conductive skeleton/polyimide thermally conductive composite material comprises subjecting thermally-conducting porous material soaked by polyamic acid solution, performing freeze drying and phase conversion treatment to thermally-conducting porous material.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

Preparing thermally conductive filler/polyimide aerogel metallized high thermally conductive composite material, involves preparing thermally conductive filler/polyimide aerogel, electroplating aerogel material, and vacuum hot pressing.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D