国家/地区 中国（4）
IPC部 C（6） B（3）
IPC大类 C08（6）
IPC小类 C08K（6） C08L（6） C08J（2）
IPC C08L083/04（6）
发明人
公开年 2022（6）
申请年 2020（6）
专利权人

Condensation curable composition used as article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises condensation curable organopolysiloxane, silicone-imide crosslinker, condensation cure catalyst and additive.

DEY K, MILLER C, KONWAR D B, RAJENDRA V, FUJIMOTO T, MANDAL S

Automobile electronic electromagnetic wave shielding composition useful for automobile electronic products i.e. electric vehicles comprises thermally conductive synthetic resin, mixed base polymer, graphene and inorganic filler.

CHOI J H, HWANGINSEONG, PARK Y S, CHAN H, PARK K

Composition system useful for preparing fully degradable and recyclable three-dimensional printed piece, comprises mixed dispersion of siloxane hydrolyzate and alkaline solution, low surface energy polymer solution, and inorganic filler.

XU J, ZHAO N, ZHU G, HOU Y

High heat resistance polyamide plastic, comprises PA resin, polyamide, glass fiber, hydroxyl silicon oil, hydroxy silicone oil, polyacrylate, auxiliary agent, ethanol, and water soften.

LU S

Graphene film, which is not calendered, and graphene film has airtight bubble structure.

WANG N

Thermally conductive gasket used in electronic device, has adjacent thermally conductive fillers in direct contact to form a three-dimensional thermally conductive network containing internal voids and inner voids of three-dimensional thermally conductive network filled with high molecular polymers.

JIANG N, LIN Z, CHU W, DAI W, LI M, YU J