国家/地区 中国（63） 世界知识产权组织（4） 韩国（2） 美国（2）
IPC部 C（68）
IPC大类 C08（68）
IPC小类 C09K（68）
IPC C09K005/14（68）
发明人 CHEN J（4） HU J（4） LIU Y（4）
GE X（3） JIANG X（3） LI Z（3）
PAN Z（3） WANG X（3） WU X（3）
YANG S（3） ZENG X（3） ZHOU M（3）
ZHOU S（3） CHEN X（2） HE Y（2）
公开年 2022（46） 2023（22）
申请年 2022（68）
专利权人 HANGZHOU FUX.（4） ANHUI AEROSP.（3） CHANGZHOU WI.（2） DONGGUAN JIA.（2）
ELEMENT CO L.（2） UNIV BEIJING.（2） UNIV GUANGDO.（2） UNIV TSINGHU.（2）

Preparing graphene heat-conducting silicone grease comprises e.g. adding graphite into ultrapure water, stirring, using mechanical stripping process to obtain graphene slurry, filtering to get filter cake, adding transfer solvent, stirring, and utilizing transfer solvent to wash graphene slurry.

MA Y, LI Y, FENG J, LI X, LIU H

Preparing high thermal conductivity and low dielectric epoxy composite material used in electronic packaging field, involves preparing polyimide, dispersing polyimide microspheres and low-dimensional thermally conductive insulating fillers in solvent, mixing polyimide microsphere with epoxy resin.

ZHONG R, LIANG J, CAI H, TU S, HU D

Highly flexible thermal gasket, comprises vinyl silicone oil (e.g. vinyl-terminated polydimethylsiloxane), hydrogen-containing silicone oil (e.g. terminal hydrogen-containing silicone oil), thermal conductive filler (e.g. alumina), catalyst, coupling agent, and inhibitor.

LIN Y, CHEN D, LIU W, XIANG L, JIANG X

Preparing high thermal conductivity insulating polyvinyl butyral intermediate film, comprises e.g. adding few-layer graphene and dispersant into solvent, using high-shear equipment to stir, adding hexagonal boron nitride, silane coupling agent hydrolysis liquid, and polyvinyl butyral, and stirring.

BOHM S, XIAO F, LIU S, QIAO S, RONG C, FENG D

Heat conducting filler master batch used in polypropylene composite material for extruding and absorbing plastic and preparation of electronic components, comprise high pressure polyethylene, aluminum oxide, graphene, coupling agent, dispersant, and antioxidant.

CHEN P, XU H, SHE H, HUANG F, CHEN X, GONG W

Heat-conducting gel used for heat dissipation of electronic device, comprises silicone oil matrix, bisphenol-A-type epoxy resin and heat-conducting filler comprising modified graphene, modified diamond and modified carbon nanotubes, where surface of modified graphene is modified with amino group.

HE Y, LIU F, YU G

Preparing graphene/zirconium-BDC-metal-organic framework/perovskite quantum dot high thermal conductivity composite material comprises e.g. dispersing quantum dots in toluene, taking zirconium oxychloride octahydrate, washing, placing sodium nitrate into beaker, adding sulfuric acid and compounding.

WANG S, LUAN Y

Polyurethane high-thermal conductivity film used as photothermally controllable film, is prepared by reacting three-dimensional carbon composite powder and thermoplastic polyurethane, concentrating obtained three-dimensional carbon/polyurethane assembly, dripping on substrate and heat-treating.

CHEN J, WANG C, LI H, LUO W

Heat-conducting gel for battery filling, comprises silicone A, thermal conductive filler, cross-linking agent as component A, and silicone B, catalysts, chain extender as component B, and prepared by mixing silicone A, thermally conductive filler and crosslinking agent to obtain component A.

LIN Y, CHEN F, XIANG L, JIANG X

Preparation of oriented heat conducting sheet used in semiconductor heat dissipating device, involves placing fluid composition in orientation molding device having sleeve barrel, applying circumferential shear force, heat-curing formed multilayer aggregate, and slicing oriented composition block.

REN Z, WANG H, GU Z