国家/地区 美国（5）
IPC部 C（5）
IPC大类 C08（5）
IPC小类 C08K（5） C08J（4） C08L（3）
B29C（2） B32B（2） C08F（2）
H05K（2）
IPC C08K013/04（5）
发明人
公开年 2021（3） 2023（2）
申请年 2021（2） 
专利权人

Thermally conductive material comprises base polymer, ethylene methyl acetate, graphite fibers and bis(2-ethylhexyl) adipate.

PARE R, KAMAVARAM V

Composition for producing sheet molding compound, comprises thermoset resin, multiple graphene flakes dispersed in thermoset resin having lateral dimension and thickness, and reinforcement material dispersed in thermoset resin.

NAZARPOUR S, MOGHIMIAN N

Resin composition used to form dielectric substrate layer and prepreg used to form printed circuit board, comprises polymeric based material and fillers comprising hollow fillers comprising hollow filler, and material of hollow filler is silicon dioxide.

CHANG C, WU Y, ZHANG C

Electroconductive polymer composition used in electronics packaging, comprises electroconductive metal filler material comprising metal particle(s) having aspect ratio, carbon-based filler material having aspect ratio, and polymer matrix.

CHEN K, TAUBERT C J, VOGT B D, ZHU Y

Manufacture of substrate for device for shielding electromagnetic radiation, involves providing polymer material and/or precursor comprising conductive filler, and subjecting polymer material and/or precursor to shaping with material bond.

SCHROIFF V, SUTTER M, HAUER M, GRUNE E