国家/地区 台湾（3）
IPC部 B（3）
IPC大类 B32（3）
IPC小类 B32B（3）
IPC B32B027/08（2） C08K013/02（2）
发明人
公开年 2021（2）
申请年 2020（3）
专利权人

Condensation curable composition used as article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises condensation curable organopolysiloxane, silicone-imide crosslinker, condensation cure catalyst and additive.

DEY K, MILLER C, KONWAR D B, RAJENDRA V, FUJIMOTO T, MANDAL S

Resin composition used to prepare prepreg for metal-clad laminate for preparing printed circuit board, comprises bismaleimide compounds and vinyl-containing elastomer.

CHIANG J, CHIOU J, LIU S

Manufacturing laminated polyester film for e.g. tape, by mixing mechanically recycled polyester pellet and chemically recycled polyester pellet containing electrostatic adhesion additive, melting, forming polyester film layer and laminating.

LIAO T, YANG W, YANG C, HSIAO C, YUAN C