国家/地区 韩国（5） 中国（2）
IPC部 C（7）
IPC大类 C08（7）
IPC小类 C08K（7）
IPC F21V029/87（4） F21Y115/10（4） C08K003/04（3）
C09D005/18（3） C09D007/61（3） C09D163/00（3）
C08K003/38（2） C08L101/00（2） F21V029/85（2）
发明人 KIM S W（2） LIM J J（2） TANG J（2）
WANG K（2） YAO L（2）
公开年 2021（5） 2022（2）
申请年 2021（7）
专利权人 LASER LIGHTI.（2） SICHUAN YIFE.（2）

Heat-dissipating coating composition useful for producing LED lighting luminaire, comprises carbon nanotubes, epoxy resin, dispersibility improving copolymer, photoinitiator, and thermally conductive material.

PARK J, KWON Y K

Manufacturing heat dissipation sheet e.g. for light-emitting diode lighting lamp comprises e.g. mixing heat dissipation sheet main raw material of conductor powder and additives in bind composed of liquid nitrile rubber-modified epoxy resin.

BAEK L J

Preparing radiating eye-protecting table lamp comprises e.g. preparing base, support, lampshade shell and lampshade cover plate, assembling base, support, lampshade shell, lampshade cover plate and LED lamp assembly, and forming base, support and lampshade shell by injection molding.

WANG K, TANG J, YAO L

Graphene heat dissipation lamp for studying, comprises graphene composite thermally conducting plastic radiator comprising outer thermal conductive layer and inner thermal conductive layer and LED light source board mounted on radiator.

YAO L, TANG J, WANG K, CHEN Z

Paint composition having excellent heat dissipation effect useful for producing light-emitting diode lighting fixture, comprises aluminum nitride powder, epoxy resin, boron nitride powder, photoinitiator and conductive material.

KIM S W, LIM J J

Lighting fixture e.g. lamp, is applied with heat dissipation composition comprising polymer resin, dispersion stabilizer and thermally conductive filler, which is surface-modified with silane coupling agent after coating with agarose.

SHIN J, SHIM S E

Heat dissipation paint composition for preparing LED lighting fixture comprises boron nitride powder pretreated with ammonia plasma and an epoxy resin.

KIM S W, LIM J J