国家/地区 韩国（5） 中国（3）
IPC部 C（7）
IPC大类 C08（7）
IPC小类 C08K（7）
IPC F21V029/85（4） F21V029/87（4） C08K003/04（3）
F21Y115/10（3） B29C045/00（2） C08K003/38（2）
C08K007/06（2） C08L101/00（2） C09D005/18（2）
C09D007/61（2） C09D163/00（2） C09K005/14（2）
发明人 KIM S W（2） LIM J J（2） TANG J（2）
WANG K（2） YAO L（2）
公开年 2021（7）
申请年 2021（5） 
专利权人 AMOGREENTECH.（2） LASER LIGHTI.（2） SICHUAN YIFE.（2）

Preparing radiating eye-protecting table lamp comprises e.g. preparing base, support, lampshade shell and lampshade cover plate, assembling base, support, lampshade shell, lampshade cover plate and LED lamp assembly, and forming base, support and lampshade shell by injection molding.

WANG K, TANG J, YAO L

Graphene heat dissipation lamp for studying, comprises graphene composite thermally conducting plastic radiator comprising outer thermal conductive layer and inner thermal conductive layer and LED light source board mounted on radiator.

YAO L, TANG J, WANG K, CHEN Z

Paint composition having excellent heat dissipation effect useful for producing light-emitting diode lighting fixture, comprises aluminum nitride powder, epoxy resin, boron nitride powder, photoinitiator and conductive material.

KIM S W, LIM J J

Lighting fixture e.g. lamp, is applied with heat dissipation composition comprising polymer resin, dispersion stabilizer and thermally conductive filler, which is surface-modified with silane coupling agent after coating with agarose.

SHIN J, SHIM S E

Heat dissipation paint composition for preparing LED lighting fixture comprises boron nitride powder pretreated with ammonia plasma and an epoxy resin.

KIM S W, LIM J J

Light emitting diode headlamp module for automobiles, consists of metal plate for supporting lamp, and heat dissipation case formed of heat-resistant plastic, and comprising region accommodating metal plate, and region having protrusion.

LEE H K

Heat-dissipating plastic used for e.g. electronic component, comprises polymer matrix including main resin, and carbon-based filler including fibrous carbon-based filler and granular carbon-based filler, dispersed in polymer matrix.

LEE J H, LI Z