国家/地区 世界知识产权组织（2）
IPC部 C（3）
IPC大类 C01（3）
IPC小类 C01B（3）
IPC C01B032/19（3）
发明人
公开年 2021（2）
申请年 2021（3）
专利权人

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Manufacture of microfibrous cellulose nanocarbon containing material used in e.g. electrochemical device, involves performing miniaturization process on liquid mixture comprising cellulose fiber, and solvent, and suppressing bubbling.

YUICHI N, YUSAKU I, MASATO S, NOGUCHI Y, SAITO M, IMAMURA Y

Preparing elastomer filled conductive 2-dimentional (2D) nanoparticles involves blending elastomer polymer precursor and layered material to get conductive nanoparticle-filled polymer precursor and mixing with elastomer polymer curing agent.

LYNCHBRANZOI J K, ASHRAF A