国家/地区 中国（3）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C08G（4）
IPC C08G059/40（4）
发明人 LIU J（4）
公开年
申请年
专利权人

Preparing high-reliability epoxy resin absorbing adhesive film with controllable fluidity by mixing epoxy resin matrix and toughener to compound epoxy resin system, placing epoxy resin system, absorbent, and inorganic filler into resin internal mixer for banbury rough mixing and fine mixing.

GONG Y, LIU J, LI M, LI Y, LV T

Weather-resistant high heat-conducting graphene based epoxy resin adhesive comprises epoxy resin, reaction diluent, double-component curing agent, accelerator, coupling agent, aminated graphene oxide and tin-bismuth alloy nano particles.

WANG Y, LI H, ZHA Y, XU X, WU X, LIU J, DENG X

Aqueous-based epoxy coating useful for floors epoxy resin as low molecular liquid epoxy resin, epoxy curing agent as phenolic vinyl resin and silicone resin, epoxy diluent, graphene, dispersant, defoamer, thickener and water.

LIU J

Insulated thermal interface material for applying between electronic element e.g. central processing unit, and thermal dissipating element, comprises base including polymer, and filler including graphene dispersed in base.

LING Y, WANG C, LIU J, LING Y C, WANG C P, LIU J Y