国家/地区 中国（4）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C08G（4）
IPC C08G059/50（4）
发明人 LIU J（4）
公开年 2021（2）
申请年 2021（2） 
专利权人 CHANGZHOU SH.（2）

Preparing high-reliability epoxy resin absorbing adhesive film with controllable fluidity by mixing epoxy resin matrix and toughener to compound epoxy resin system, placing epoxy resin system, absorbent, and inorganic filler into resin internal mixer for banbury rough mixing and fine mixing.

GONG Y, LIU J, LI M, LI Y, LV T

Electronic adhesive for packaging graphene-based semiconductor chips, comprises epoxy resin, reactive diluent, two-component curing agent, accelerator, coupling agent, aminated graphene oxide, one-dimensional carbon nanotubes, and composite powder comprising sheet and spherical silver powders.

WANG Y, LI H, ZHA Y, XU X, WU X, LIU J, DENG X

Weather-resistant high heat-conducting graphene based epoxy resin adhesive comprises epoxy resin, reaction diluent, double-component curing agent, accelerator, coupling agent, aminated graphene oxide and tin-bismuth alloy nano particles.

WANG Y, LI H, ZHA Y, XU X, WU X, LIU J, DENG X

Sulfanilic graphene oxide doped sulfonated polyether ether ketone/epoxy resin semi-interpenetrating proton exchange membrane material comprises e.g. epoxy resins diethylenetriamine crosslinking agent as main body.

GUO Q, LIU H, LIU J, XU F, YU Z, BI C, HUANG Y