国家/地区 中国（6）
IPC部 C（6）
IPC大类 C08（6）
IPC小类 C08G（6）
IPC C08K003/04（2）
发明人 ZHANG X（6）
公开年 2023（6）
申请年 2022（3）  2023（2） 
专利权人

Carbon dioxide-based bi-component polyurethane thermal-conducting adhesive comprises isocyanate terminated double ended polyurethane prepolymer, spherical alumina as thermally conductive filler, polyether polyol, polybutadiene polyol and small molecule polyol.

CAO Y, LIU T, LIN H, ZHANG X

Microsphere useful in collecting clean water from environmental water using solar energy to obtain fresh water and in the fields of energy utilization, seawater desalination, and photothermal sterilization, comprises bio-based material and photo-thermal conversion material.

ZHANG J, YU J, ZHANG X, XU Z, JI X, WEN C, TIAN W

Preparing double layer composite material bionic motor behavior driver comprises e.g. adding polyethylene glycol and stannous octoate into a three-necked flask, mixing, introducing nitrogen, cooling, placing the product in a vacuum oven, drying, adding thermal initiator and ultrasonicating.

ZHU X, DING G, DING H, ZHANG X

Preparing high temperature resistant thermosetting supramolecular shape memory polyimide used in aerospace, has e.g. mixing graphene oxide, organic solvent, diamine and dianhydride and polycondensing, subjecting borate-terminated polyamic acid solution to solvent removal and thermal imidization.

WANG T, ZHANG Y, WANG X, WANG Y, ZHANG X, ZHANG N, WANG Q, YANG Z

Covalent organic framework material useful in aqueous-based light-rechargeable proton batteries, where material has redox sites having light-responsive proton deintercalation activity, and redox site is carbonyl/hydroxy, nitroxide free radical, triazinyl and/or nitrogen cation.

ZHANG X, FENG Y, JIAO L, WANG Y

Binder useful for curing radiation cooling coatings prepared by preparing novel unsaturated epoxy resin containing epoxy resin and unsaturated double bonds and preparing multifunctional curing agent containing carboxylic acid, anhydride and unsaturated double bonds.

CUI H, DAI J, WANG Y, LI L, SUN G, XIE M, HUO Y, YU H, ZHANG X, SHAN J, JIN F, LIU G, YANG C, SHI Q, LI T