国家/地区 中国（6）
IPC部 C（6）
IPC大类 C08（6）
IPC小类 C08G（6）
IPC C08G073/10（6）
发明人 WANG X（6）
公开年 2021（2）
申请年 2022（2） 
专利权人 LANZHOU CHEM.（2）

Preparing high temperature resistant thermosetting supramolecular shape memory polyimide used in aerospace, has e.g. mixing graphene oxide, organic solvent, diamine and dianhydride and polycondensing, subjecting borate-terminated polyamic acid solution to solvent removal and thermal imidization.

WANG T, ZHANG Y, WANG X, WANG Y, ZHANG X, ZHANG N, WANG Q, YANG Z

Polyimide/reduced graphene oxide composite material useful as light-driven shape memory material, comprises cross-linked polyimide and reduced graphene oxide dispersed in the cross-linked polyimide.

WANG Q, WANG T, ZHANG X, WANG X, WANG Y, YANG Z

Preparing graphene graft modified hyperbranched polyimide dielectric material, comprises e.g. pouring nitrogen into three-necked flask to exhaust air, adding N,N-dimethylformamide solution and graphene oxide, and ultrasonically dispersing.

WANG X, JIA S, MA J

Preparing functionalized cross-linked polyimide aerogel heat insulation material useful in high-end thermal insulation materials and other fields comprises adding cross-linking agent into container, adding nitric acid and stirring.

CUI S, SONG Z, WANG X, ZHAO Y, HUANG L, LIU W, YUAN M

Preparing phenyl silsesquioxane/graphene oxide/polyimide three-phase composite film comprises e.g. dissolving expanded graphite with mixed acid solution, adding potassium permanganate, centrifuging, grinding and ultrasonically vibrating.

ZHOU H, WANG X, ZHANG H, JIN L

Preparation of low dielectric constant polymer/fluorinated graphene composite material by placing graphene in reactor, introducing fluorine gas, heating, dispersing by mixing with polyamide or epoxy resin solution, molding, and heating.

FAN C, GAO J, LI B, LIU X, REN M, WANG X, WU P