国家/地区 中国（7） 美国（2） 世界知识产权组织（2）
IPC部 C（8）
IPC大类 C08（8）
IPC小类 C08G（8）
IPC C08K003/04（8）
发明人 WANG J（2） ZHANG F（2）
公开年 2015（8）
申请年 2015（4）  2014（3） 
专利权人

Preparing bacterial cellulose/polyaniline/graphene film material used as electrode in supercapacitor, comprises adding acidified graphene into a surfactant, dispersing in hydrochloric acid solution, adding aniline monomer and stirring.

LIU R, MA L, YUAN G, ZHANG F, LI E

Preparation of three-dimensional graphene/polyaniline/cobalt oxide composite material for electrode material, involves adding divalent cobalt salt and graphene oxide to crude product of graphene oxide/polyaniline and reacting mixture.

CHANG X, CHU L, HE Z, HUANG Q, JIANG J, LIN H, LIU F, LIU Y, LI F, MA P, WANG C, XIONG L, ZHOU J, WANG J, HANG Z, AI Y, WANG X

Electrically conductive paste used for solar cell and for producing electrodes used in printed circuit board, comprises bismaleimide, matrix resin, epoxy diluent, dispersing agent and modified nano silver flakes supported graphene.

CHEN G, HUANG J, LIANG W, XU X, WANG S

Sulfanilic graphene oxide doped sulfonated polyether ether ketone/epoxy resin semi-interpenetrating proton exchange membrane material comprises e.g. epoxy resins diethylenetriamine crosslinking agent as main body.

GUO Q, LIU H, LIU J, XU F, YU Z, BI C, HUANG Y

Preparation of high-electroconductive graphene material used as e.g. catalyst, involves preparing graphene colloid, mixing with pyrrole monomer, adding polyethylene powder, mixing with acetylene black and binder, and pressing.

YAO Y

Graphene-composite functional material for preparing e.g. piezoresistive material, comprises sulfonated graphene-grafted poly-3,4-(ethylene dioxythiophene).

BAO Y, CHEN S, CHEN Z, WANG J, XU G, YANG C, XING C, ZHOU C, LOU J, ZHU T

Two-dimensional, graphene-based porous polymer used for e.g. porous carbon for manufacture of e.g. supercapacitor, comprises graphene layer which is sandwiched between porous polymer which is microporous, by covalent bond.

VENKATARAMAN S S, FENG X, ZHUANG X, ZHANG F, WU D

Molding composition for a semiconductor package comprises a liquid crystal thermosetting polymer resin and graphene oxide.

JI S Y, KIM S H, CHI S, KIM S