国家/地区 中国（3）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C08G（4）
IPC C08G073/10（4）
发明人 JIANG X（4）
公开年 2019（3）
申请年 2019（3） 
专利权人 JIANGSU YABA.（3）

Polymer composition used in semi-conductors, consumer electronics and industrial constructions, comprises polyetherimide resin, crystalline polyester resin, inherently dissipative polymer, and transesterification inhibitor.

JIANG X, ZHENG Y, CHENG Y

Preparing functional graphene modified polyimide film by adding diamine and dianhydride in reaction kettle, stirring synthesized polyimide resin and modified graphene in reaction kettle, removing bubbles in film liquid, and deaerating.

WANG Y, XU W, YIN A, QI X, JIANG X, LI J, XU P, GAO S

Preparing polymerized graphene hybrid modified polyamic acid resin preparing polyimide film product, by adding graphene to nitrogen-dimethylformamide solution, dispersing, adding isopropanol pinacol borate and adding diamine and dianhydride.

WANG Y, XU W, YIN A, QI X, JIANG X, LI J, XU P, GAO S

Ultra-thin ultra-low shrinkage graphene polyimide thermal conductive film comprises polyimide, tert-butyl ((4-hydroxycyclohexyl)methyl)carbamate and graphene.

WANG Y, XU W, YIN A, QI X, JIANG X, LI J, XU P, GAO S