国家/地区 中国（6）
IPC部 C（6）
IPC大类 C08（6）
IPC小类 C08G（6）
IPC C08L079/08（6）
发明人
公开年 2016（6）
申请年 2016（5） 
专利权人

Heat resistant high strength polyimide film comprises e.g. sulfur-containing diamine, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 2,2-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride, and graphene.

WEI S

Graphene/polyimide nanocomposite material includes graphene powder, p-phenylenediamine, 4,4'-diaminobenzophenone, pyromellitic dianhydride, phenanthrene-1,8,9,10-tetracarboxylic dianhydride, N-methylpiperidine and montmorillonite.

PENG X, WANG F

Preparation of polyimide/graphene nanobelt composite film involves adding graphene nanobelt solution to water-soluble polyimide solution, stirring, obtaining graphene nanobelts/polyamic acid solution, spin-coating and heat-treating.

LIU X, SUN X, ZHANG Z

Production of graphene/polyimide composite material involves reacting oxidized graphene, dimethylsulfoxide, vinyl dimethoxy silane, N,N-methylene bisacrylamide, triethylamine and 2-vinyl-5-mercaptoaniline.

PAN Y, MENG H

Preparing graphene and polyimide composite film involves using room temperature, atmospheric pressure, nitrogen protection and adding functionalized graphene into the polar solvent and dispersing, for two to six hours.

HAN S, LIU L, WANG W, WANG J, WEI H, ZHANG C, SUN G

Graphene/polyimide composite material is obtained by dissolving graphene oxide in organic solution, adding polyimide monomer to graphene oxide solution, polymerizing, forming graphene oxide/polyimide composite material, and reducing.

LIU Y, MIN Y, PENG L, YANG W, XIAO Z, FENG Y