国家/地区 韩国（7）
IPC部 B（7）
IPC大类 C08（7）
IPC小类 C08G（7）
IPC C01B031/02（5） B82Y030/00（4） B82Y040/00（3）
C01B031/04（3） C08G061/10（3） B82B003/00（2）
C07C015/14（2） C08K003/04（2）
发明人 FENG X（3） MUELLEN K（3） MULLEN K（3）
SCHVAB M G（2） SCHWAB M G（2） SCHWAB M G S（2）
公开年 2013（6）
申请年 2012（7）
专利权人 BASF AG（3） BASF SE（3） BASF CHINA C.（2） MAX PLANCK G.（2）

Transferring graphene in substrate comprises spin-coating substrate with polymer and then curing, preparing synthesized graphene on catalytic metal, transferring graphene to substrate, and attaching graphene to surface of substrate.

JUNG S, KIM Y, LEE Y C

Composite comprises polyimide, graphene, carbon nanotubes, and silicon carbide.

TAE O W, HAN K D

New oligophenylene monomer useful for preparing a polymeric precursor for producing graphene nanoribbons useful in an electronic, optical, or optoelectronic device.

SCHWAB M G, NARITA A, FENG X, MUELLEN K, MULLEN K, SCHWAB M G S, SCHVAB M G, MILLEN K

Segmented graphene nanoribbon useful for generating heterojunctions and heterostructures, comprises at least two different graphene segments covalently linked to each other.

BLANKENBURG S, CAI J, FASEL R, FENG X, MUELLEN K, PASSERONE D, PIGNEDOLI C, RUFFIEUX P, MULLEN K, PIGNEDOLI C A, TSAI J, CAI Y

New graphene nanoribbon precursors comprising polycyclic aromatic hydrocarbon repeat units, used in graphene nanoribbons for field-effect transistors.

SCHWAB M G S, MUELLEN K, FENG X, DOESSEL L, SCHWAB M G, MULLEN K, DOSSEL L, SCHVAB M G

Manufacture of resin compound material involves uniformly dispersing carbon material having graphene structure in synthetic resin chosen from crystalline resin and non-crystalline resin under specified conditions.

SAWA K, TSUMURA K, INUI N, TAKAHASHI K, TANIGUCHI K

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S