国家/地区 世界知识产权组织（4）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C08G（4）
IPC C08K003/04（4）
发明人 JIN R（2） KIM Y S（2）
公开年 2021（2）
申请年 2021（3） 
专利权人 TICONA LLC（2）

Composite material used for forming structural material, comprises closed cell polyurethane matrix portion exhibiting properties associated with wood, and particulate portion homogeneously distributed and suspended in matrix portion, where particulate portion is fiberglass and hemp fiber.

CHRISTY J, ESCOBAR H

Electronic device e.g. printed circuit board, comprises singulated carrier portion, substrate molded onto singulated carrier portion, and conductive traces disposed on substrate, where substrate comprises polymer composition that includes aromatic polymer and electrically conductive filler.

KIM Y S, JIN R

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Photosensitive polyimide resin composition comprises photosensitive polyimide derivative, photoinitiator, free radical polymeric compound, solvent, alumina, graphene, inorganic clay, silicon oxide and zinc oxide.

HUANG T, ZHUANG C, SHI Y, XIE K, HUANG T C, CHUANG C C, SHIH Y C, HSIEH K H