国家/地区 美国（5）
IPC部 C（5）
IPC大类 C08（5）
IPC小类 C08G（5）
IPC C08G073/06（5）
发明人 ALEKSOV A（2） EID F（2） ELSHERBINI A A（2）
STRONG V A（2） SWAN J M（2）
公开年 2021（2）
申请年
专利权人 INTEL CORP（2）

Microelectronic package used for electrical device e.g., handheld or mobile electrical device comprises a die, and package substrate which comprises electrostatic discharge protection material including electrically-conductive carbon allotrope and electrically-conductive polymer.

EID F, ELSHERBINI A A, ALEKSOV A, SWAN J M, STRONG V A

Providing electrostatic discharge protection in electrical device, comprises a first electrically-conductive carbon allotrope, a second electrically-conductive carbon allotrope, and an electrically-conductive polymer.

EID F, ELSHERBINI A A, ALEKSOV A, SWAN J M, STRONG V A

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Preparing glue composition involves adding graphene powder and polymer monomer, where mixture is added with solvent.

CHEN Y, LI Y, ZHANG X, LEE Y

Graphene dispersion used for manufacturing graphene-ionic liquid polymer composite, comprises graphite dispersed in ionic liquid.

SUH K S, KIM J E, KIM T Y, KIM J, KIM T