国家/地区 日本（3）
IPC部 B（3）
IPC大类 C08（3）
IPC小类 C08G（3）
IPC C08K003/04（3） C08L063/00（2）
发明人
公开年 2012（3）
申请年 2011（2） 
专利权人

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S

Polymer composition, useful to make molded articles and extruded articles (rods, tubes, sheets or films), comprises poly(arylether ketone), and non-tubular graphene material (nano-graphene platelets).

KWAN K S, ELHIBRI M J, MILTNER H E, KWAN K, ELHIBRI M, MILTNER H, HIBEURI M J E

Polymer resin composition useful for manufacturing an insulating film for manufacture of a build-up multi-layered printed circuit board, comprises polymer resins, and graphene for linking the polymer resins with larger attraction.

LEE K S, HONG S S, LIM H H, LEE H Y, CHO J C, KYU S L, SANG S H, HYUN H L, HWA Y L, JAE C C, HONG S, LEE H, LEE K, LIN H, JO J, LIM H, CHO J