国家/地区 韩国（7）
IPC部 C（7）
IPC大类 C08（7）
IPC小类 C08G（7）
IPC C08K003/04（5） B82B003/00（2） C08L063/00（2）
C08L101/00（2）
发明人
公开年 2012（7）
申请年 2011（3）  2010（2）  2012（2） 
专利权人 UNIV PUSAN N.（2）

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S

Resin composite material is obtained by chemically bonding reactive polyfunctional compound to both of thermoplastic resin, and carbon material having graphene structure.

MUKOHATA D, INUI N, TAKAHASHI K, OSANO K, MUKAIHATA D

Polynorborene/graphene oxide composite material has modified griffin oxide in which griffin oxide surface is modified by compound having amine group and functional groups.

HA C S, CHOI M C, LEE D W, KIM G Y

Conductive polyketone comprises mixture of specified amount of graphene and linear alternating polyketone polymer containing ethylenic unsaturated hydrocarbon and carbon monoxide.

CHO H S, KIM H S, CHOI S M

Waterborne polyurethane/vinyl-modified graphene oxide nanocomposite is obtained by mixing vinyl group-modified graphene oxide with waterborne polyurethane having terminal vinyl group.

KIM B G, YOON S H

Polymer composition, useful to make molded articles and extruded articles (rods, tubes, sheets or films), comprises poly(arylether ketone), and non-tubular graphene material (nano-graphene platelets).

KWAN K S, ELHIBRI M J, MILTNER H E, KWAN K, ELHIBRI M, MILTNER H, HIBEURI M J E

Polymer resin composition useful for manufacturing an insulating film for manufacture of a build-up multi-layered printed circuit board, comprises polymer resins, and graphene for linking the polymer resins with larger attraction.

LEE K S, HONG S S, LIM H H, LEE H Y, CHO J C, KYU S L, SANG S H, HYUN H L, HWA Y L, JAE C C, HONG S, LEE H, LEE K, LIN H, JO J, LIM H, CHO J