国家/地区 印度（4）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C08G（4）
IPC C08L083/04（4）
发明人
公开年 2021（2）
申请年
专利权人

One-component thermal-gel composition used for heat dissipating material for dissipating heat from substrate, comprises crosslinkable organopolysiloxane, hydrolyzable organopolysiloxane, thermal conductivity enhancing agent, organopolysiloxane, adhesion promoter, antioxidant, and pigment.

DUTTA P, DASGUPTA D, MS A, FUJIMOTO T, CHISATO H, ANJITHA M, HOSHINO C

Additively manufacturing silicone elastomer article by applying additive manufacturing material on substrate and forming layer by addition-crosslinking electro-conductive silicone composition containing e.g., organopolysiloxane and catalyst.

YUE Y, JIA L

Composition used for forming article, comprises soft elastomer, conductive nanostructure and metal ferrite doped reduced graphene oxide.

RAJALAKSHMAN PAI A, THOMAS S, KALARIKKAL N, PAI A R

Functionalized graphene used for preparing polyorganosiloxane comprises active molecule and graphene.

XU Y, LI Y, HODGE S, FERRARI A, LIN Y