国家/地区 台湾（6）
IPC部 C（6）
IPC大类 C08（6）
IPC小类 C08G（6）
IPC C08K003/04（5） C08L067/04（3） H05K009/00（3）
C08G063/06（2） C08G063/60（2） C08K003/08（2）
C08K003/34（2） H01B001/12（2） H05K001/03（2）
发明人 JIN R（2） KIM Y S（2）
公开年 2021（3） 2022（3）
申请年 2021（6）
专利权人 TICONA LLC（2）

Composition used in electronic component for shielding electromagnetic waves, comprises silver particles, resin and alkoxysilane compound.

TAKASHI Y, YONEDA T

Bio-resin composite for bio-foam material comprises a polymer matrix, a toughener, dispersed in the polymer matrix, and an antistatic agent, present at an interface between the polymer matrix and the toughener and/or present in the toughener.

LIOU S, LIU Y, CHENG S, CHANG S, LIAO S

Bio-electrode composition used in contact with skin of living body for detecting physical conditions such as heart rate, comprises (A) reaction composite comprising ionic polymer material and carbon particle.

HATAKEYAMA J, SHANRUN

Coating insulation component in high temperature, high voltage and/or corrosive environments, by applying coating of heat processing composition of crosslinkable aromatic polymer to exterior surface of insulation component and crosslinking.

DRAKE K A, SONG L, GAVLIK R, GABRIEL R

Electronic device e.g. printed circuit board, comprises singulated carrier portion, substrate molded onto singulated carrier portion, and conductive traces disposed on substrate, where substrate comprises polymer composition that includes aromatic polymer and electrically conductive filler.

KIM Y S, JIN R

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R