国家/地区 台湾（4）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C08G（4）
IPC C08K003/04（4）
发明人
公开年 2022（2）
申请年 2021（3） 
专利权人

Composition used in electronic component for shielding electromagnetic waves, comprises silver particles, resin and alkoxysilane compound.

TAKASHI Y, YONEDA T

Bio-resin composite for bio-foam material comprises a polymer matrix, a toughener, dispersed in the polymer matrix, and an antistatic agent, present at an interface between the polymer matrix and the toughener and/or present in the toughener.

LIOU S, LIU Y, CHENG S, CHANG S, LIAO S

Electronic device e.g. printed circuit board, comprises singulated carrier portion, substrate molded onto singulated carrier portion, and conductive traces disposed on substrate, where substrate comprises polymer composition that includes aromatic polymer and electrically conductive filler.

KIM Y S, JIN R

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q