国家/地区 中国（4）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C08K（4）
IPC C08K003/04（4）
发明人 CHEN Y（4）
公开年 2017（3）
申请年 2016（3） 
专利权人 UNIV GUANGDO.（2）

Preparing high-performance thermally conductive plastic composite material by mixing polymer matrix material, urotropine and wood fiber, adding coupling agent to absolute ethanol solvent, adding thermal conductivity additive, and filtering.

CHEN Y, MU X

High thermal conductivity type epoxy resin composite material for LED bonding layer, contains bisphenol A type epoxy resin, boron carbide powder, aluminum oxide, glue 107, dibutyltin dilaurate, ethyl orthosilicate, graphene oxide.

LI H, LIU Y, CHEN Y

Preparation of high-thermal-conductivity composite plastic filled with three-dimensional graphene, for use in heat exchangers, involves mixing graphene surface-modified with surfactant, and molten plastic substrate, and pressing.

LI Y, ZHANG H, LIN Y, WANG S, CHEN Y

Preparing high-molecular matrix/three-dimensional graphite composite material used in integrated circuit, involves dispersing graphene in de-ionized water, adding surfactant, heating mixture and mixing with polymeric substrate.

LI Y, ZHANG H, LIN Y, WANG S, CHEN Y