国家/地区 美国（4）
IPC部 C（4） H（3）
IPC大类 C08（4）
IPC小类 C08K（4）
IPC C08K003/04（4）
发明人 CHI S（2） JI S Y（2） KIM S（2）
KIM S H（2）
公开年
申请年
专利权人 SAMSUNG ELEC.（2）

Coated particle used in hydraulic fracturing composition for treating subterranean formation, comprises particulate substrate, surface copolymer layer having copolymer of monomers e.g. styrene, carbonates, and acrylamides, and resin layer.

LI W, ALSHARAEH E, ALMOHSIN A, BATAWEEL M A

Molding composition for a semiconductor package comprises a liquid crystal thermosetting polymer resin and graphene oxide.

JI S Y, KIM S H, CHI S, KIM S

Insulating layer composition for use in substrate of insulating prepreg or insulating film and printed circuit board, comprises soluble type liquid crystal thermosetting oligomer, metal alkoxide compound, and graphene oxide.

JI S Y, HAM S J, KIM S H, KIM D Y, YEONG J S, JIN H S, HWAN K S, YEONG K D, CHI S, KIM S, KIM D, HAM S, CHI S Y, HAMSUKJIN

Electrically insulating and thermally conductive composition useful in electronic device e.g. computer, comprises resin, electrically insulating and thermally conductive powder, and graphene in specific amounts.

LIN C, WU M, CHIOU K, LIN C L, WU M J, CHIOU K C, LIN Z, QIU G