国家/地区 中国（3）
IPC部 C（3）
IPC大类 C08（3）
IPC小类 C08J（3）
IPC C08J007/044（3）
发明人 SHAO Z（2） SUN J（2） WU B（2）
ZHENG N（2）
公开年 2023（2）
申请年 2022（2） 
专利权人 TAN KAH KEE .（2） UNIV XIAMEN（2）

Conductive ink used for preparing electroplated plastic, comprises water-based resin binder, conductive filler, swelling agent and solvent.

ZHENG N, SUN J, SHAO Z, WU B

Conductive ink used for preparing plastic material, comprises resin binder, conductive filler, pore-forming agent and solvent, where resin binder comprises epoxy resin, polyurethane, alkyd resin, silicone resin, thermosetting acrylic resin and/or thermoplastic acrylic resin.

ZHENG N, SUN J, SHAO Z, WU B

Electroplating of metal on surface of insulating base material for printed circuit board, involves mixing resin and solid filler to obtain resin coating, coating conductive substance forming film and placing in plating solution.

LAI Z, LIANG X, ZHAO T, LIU D, SUN R