国家/地区 日本（8）
IPC部 C（8） H（8） A（2）
IPC大类 C08（8）
IPC小类 C08K（8）
IPC C08K003/04（6） H01B001/12（4） H01B001/24（3）
A61B005/256（2） A61B005/263（2） A61B005/268（2）
A61B005/279（2） A61B005/28（2） C08F212/14（2）
C08F220/18（2） C08F220/38（2） C08F220/58（2）
C08F230/08（2） C08K003/08（2） C08K007/06（2）
发明人 HATAKEYAMA J（2）
公开年 2022（5） 2021（2）
申请年 2021（8）
专利权人 SHINETSU CHE.（2）

Conductive polymer solution used for manufacturing conductive polymer film, comprises polythiophene containing thiophene-based structural units and graphene compound.

KAWAKAMI J

Conductive composition used for forming conductive film used for applications such as conductive wiring, antenna materials for radio frequency identification, electromagnetic wave shielding materials, and materials for sensors, comprises binder resin and boron-containing carbon material.

NAKASONE D, KAWAHARA J, ANDO A

Bio-electrode composition used for detecting heart rate by electric signal transmitted from skin, comprises reaction composite, monomer with ionic functional group, salts of ammonium, lithium, sodium, potassium, and silver.

HATAKEYAMA J

Bio-electrode composition used in contact with skin of living body for detecting physical conditions such as heart rate, comprises (A) reaction composite comprising ionic polymer material and carbon particle.

HATAKEYAMA J, SHANRUN

Carbon material dispersion liquid used for manufacturing e.g. paints, comprises carbon material containing carbon black, organic solvent, and polymer dispersant comprising amine-containing structural unit, propanone-containing structural unit, and other structural units connected to these units.

HIROYUKI S, YOSHIKAZU M, JUN K, SEIJI D, SHIMANAKA H, MURAKAMI Y, KAMABAYASHI J, DOI S

Thermoplastic resin composition for manufacturing conductive member, is obtained by melt-kneading at least thermoplastic resin, carbon nanostructure, and graphene or carbon black having specific Brunauer-Emmett-Teller (BET) specific surface area.

YUKI K, TOMOHIRO M, MONMA T, KANDA Y

Coating insulation component in high temperature, high voltage and/or corrosive environments, by applying coating of heat processing composition of crosslinkable aromatic polymer to exterior surface of insulation component and crosslinking.

DRAKE K A, SONG L, GAVLIK R, GABRIEL R

Electronic device e.g. printed circuit board, comprises singulated carrier portion, substrate molded onto singulated carrier portion, and conductive traces disposed on substrate, where substrate comprises polymer composition that includes aromatic polymer and electrically conductive filler.

KIM Y S, JIN R