国家/地区 中国（3）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C09D（4）
IPC C08K003/04（3） C08G073/02（2） C09D007/12（2）
C09D179/02（2）
发明人
公开年 2012（4）
申请年 2012（4）
专利权人

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S

Recording material used for ink jet printing, comprises coating containing oxidized graphite alkene/polyacrylic acid copolymer ink absorbing layer, where copolymer comprises double bond graphene oxide, acrylic acid, water and initiator.

BU H, HAN J, HUANG Y, JIANG Z, LIU L, ZHANG Y, LI J

Graphene and polyaniline nanocomposite material used for high-frequency electromagnetic wave absorbing coating, prepared by mixing graphene and hydrochloric acid solution, and subjecting solution to ultrasonic dispersion.

CHEN Y, GAO X, LI L, WANG T, WANG Q, ZHANF Y, YU H, ZHU C

Preparation of aqueous metal anticorrosive paint by providing polyaniline and graphene composite, GH-26XB silicone-acrylic antiseptic emulsion, tinting pigment, alcohol ester 12, superfine talc powder, and superfine mica powder.

YANG X