国家/地区 欧洲专利局（EPO）（3） 韩国（3） 世界知识产权组织（2）
IPC部 C（6）
IPC大类 C08（6）
IPC小类 C09J（6）
IPC C08K003/04（4） C09J011/04（4） C09J007/28（2）
C09J007/30（2） C09J009/02（2）
发明人
公开年 2023（6）
申请年 2021（6）
专利权人

Reversible adhesive material used in article, comprises polyurethane matrix i.e. formed from reacting isocyanate compound with Diels-Alder adduct, or Diels Alder adduct and polyol compound with isocyanate compound, and graphene particles.

SALAVAGIONE H J, SEYLER H, QUILEZDIAZ S, GARY ELLIS J, SHUTTLEWORTH P S, GOMEZFATOU RODRIGUEZ M, QUILESDIAZ S

Photothermal conversion anti-corrosion adhesive tape in e.g. outdoor steel structures, comprises transparent protective layer resin including silicone resin, polyurethane resin or fluorocarbon resin, and photoelectric layer material including cadmium telluride or selenium-doped cadmium telluride.

PAN X, YANG H, CHEN F

Electrically conductive solvent cement used for coupling thermoplastic components comprises thermoplastic resin, solvent for dissolving the thermoplastic resin, and electrically conductive material.

LI Q, DAIGNEAULT L, MARTINO F

New fluorinated carbonotrithioic acid based binder compounds useful in conductive adhesive of anode sheet to produce secondary battery for battery module of battery pack used in electrical device.

ZHANG M, ZHAO Y, LIN J, LI X, JIN H, YANJI J, JIANGHUI L, ZHU J H

Flexible heat-dissipating adhesive sheet comprises thermally conductive adhesive layer formed on one surface of copper sheet and graphene layer formed on other surface of copper sheet in which graphene and synthetic resin are mixed.

HEE L J, HEE L Y, CHOIJINHO

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K