国家/地区 韩国（5） 中国（3）
IPC部 C（8） H（8） B（4）
IPC大类 C08（8）
IPC小类 C08K（8）
IPC C08K003/04（6） H05K009/00（5） B32B027/20（3）
C08J005/18（3） H05K007/20（3） B32B027/06（2）
B32B027/32（2） C08K003/08（2） C08L023/08（2）
C08L023/12（2） C08L023/14（2） C08L023/16（2）
C08L075/04（2）
发明人 BAI Y（2） GAO D（2） LV Y（2）
QUAN H（2） XU M（2）
公开年 2023（8）
申请年 2021（8）
专利权人 BEIJING RES .（2） CHINA PETROL.（2）

Low dielectric composite heat dissipation sheet comprises polymer heat radiation sheet layer, first adhesive layer, first ceramic film layer, second adhesive layer, first insulating layer, third adhesive layer, and second insulating layer.

YOO T H, PARK M W, WOO Y H, HWANG S H, HUANG S, YUN H, PARK M, LIU T

Producing porous composite hydrogel useful for electromagnetic interference shielding, comprises mixing vinyl-based monomer and crosslinking agent, adding carbon-based material to mixture, and forming porous composite hydrogel.

SOHN D, QUYEN V T, NO T

Composition useful in e.g. article, preferably flexible display device of electromagnetic wave shielding film and for transportation devices comprises graphene oxide, nano cellulose, reducing agent comprising hydroxy and amino group.

HONG S W, BAE S, HONG P H, LEE Y, HANUI K, CHOI K W, NO A

Antistatic polypropylene composite film useful in packaging materials, comprises at least first film layer formed from a polypropylene composition and second film layer formed from a polypropylene composition.

BAI Y, XU K, CHU L, LV Y, REN Y, GAO D, XU M, QUAN H

Electromagnetic shielding polypropylene composite film useful in field of packaging material, comprises at least one film layer formed from homopolypropylene, propylene impact copolymer and polyolefin elastomer, and at least one film layer formed from e.g. random polypropylene.

CHOU B, BAI Y, DONG M, QUAN H, GAO D, XU M, LV Y

Preparing and depositing electromagnetic absorber spray foam on electronic equipment, involves providing isocyanate resin selected such that blending the isocyanate resin with the polyol blend results in electromagnetic absorber spray foam.

COCCHINI M, DOYLE M, BENEFIELD S B, CAMPBELL E J, CONNOR S R

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Slip-type heat dissipation pad useful for preventing damage to heat dissipation pad, comprises plate-shaped heat conduction layer in which heat diffusion material is mixed and skin layer on one surface of heat conduction layer.

YOON K S, CHOI B I, YEO C