国家/地区 韩国（4）
IPC部 B（4） C（4）
IPC大类 B32（4）
IPC小类 B32B（4）
IPC B32B015/08（2） B32B027/08（2） B32B027/18（2）
B32B027/20（2） B32B027/28（2） C08K003/04（2）
发明人
公开年 2023（4）
申请年 2022（4）
专利权人

Resin composition for semiconductor package, comprises resin composition comprising resin and filler provided in resin, where resin includes soluble liquid crystal polymer resin, where soluble liquid crystal polymer resin includes an organic soluble liquid crystalline aromatic polyester.

HWANG M Y, KIM H S, LEE K E, LEE G E, KIM H

Polyimide film used in multilayer film and flexible metal clad laminate, is obtained by imidizing polyamic acid solution containing dianhydride component including e.g. biphenyltetracarboxylic dianhydride, and diamine component including e.g. m-tolidine, and comprises graphene nanoplatelets.

JEON J, YEO M, BACK S, LEE K, CHUN J, BAEK S, LEE K N

Synthetic resin pipe reinforced with improved outer peel layer comprises e.g. main layer comprising main body, inner peel layer formed as thin film on inner circumferential surface of main layer made up of vinyl chloride, and polyethylene.

HWAN K J

Polymer layer derived composition useful in a display device, comprises e.g. polyborondimethylsiloxane, benzoyl peroxide, fumed silica, glass fibers, glass powder, carbon nanotubes, graphene oxide, carbonyl iron, calcium carbonate, zinc oxide, silicone elastomer and polydimethylsiloxane.

HWANG S, LEE J, WU X, KIM J, KIM Y, SHIN H, YU W, YU W R, SHIN H J, SONG K Y, KIM J S, OH H J