国家/地区 韩国（7）
IPC部 C（7） H（3）
IPC大类 C01（7）
IPC小类 C01B（7）
IPC C08K003/04（5） C01B032/19（2） C01B032/21（2）
C08K009/02（2）
发明人
公开年 2023（7）
申请年 2021（5） 
专利权人

Polyolefin-based composite material composition for forming e.g. impact reinforcing material, comprises polyolefin resin, and particulate carbon nanostructure in which shell layers comprising graphene layer or fullerene layer are stacked.

CHOI E, YOO Y S, KIM T J, LEE S H, PARK C H

Manufacturing graphene flakes for producing coated steel pipe piles as construction material, comprises preparing iron-intercalated layered graphite using iron-intercalated layered graphite, and pulverizing using plasma pulverizer.

LEE S S, CHO J S

Polyimide film is obtained by imidization reaction of polyamic acid containing quinoline and beta-picoline as imidation catalyst and acetic anhydride as dehydrating agent.

JUNG H, WON D, WON D Y

Polydimethylsiloxane composite for heat dissipation/flame retardancy in field of automobiles and electrical/electronic comprises metal hydroxide-coated carbon body as filler based on polydimethylsiloxane.

SHIM S E, HWANG S, SO J, LEE K

Graphene domain-containing activated carbon useful in electrode of energy storage device e.g. supercapacitor comprises graphene domain exhibiting specified peak on Raman analysis graph and has porous structure.

KIM Y, KIM C H, OMITTED O

Producing nanosheet dispersion comprises reducing interlayer bonding strength by adding two-dimensional material having layered structure into solution containing aionic material and forming covalent bond by entering between layers.

NOHYONGYOUNG, KIM H J, KIM H, NOH Y Y, LU R

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K