国家/地区 欧洲专利局（EPO）（2） 韩国（2） 世界知识产权组织（2）
IPC部 C（5）
IPC大类 C08（5）
IPC小类 C09J（5）
IPC C08K003/04（4） C09J011/04（3） C09J009/02（2）
发明人
公开年 2023（5）
申请年 2021（3） 
专利权人

Hot melt adhesive composition for encapsulating electronic devices, preferably located under bonnet of vehicle or in medical devices comprises at least one aliphatic semi-crystalline copolyamide and at least one thermally conductive filler.

PRENVEILLE T

Electrically conductive solvent cement used for coupling thermoplastic components comprises thermoplastic resin, solvent for dissolving the thermoplastic resin, and electrically conductive material.

LI Q, DAIGNEAULT L, MARTINO F

Conductive adhesive useful in IGBT module chip, comprises lignin-based epoxy resin, modified graphene and curing agent; lignin-based epoxy resin is obtained by polymerization of hydroxylated lignin and epoxy resin, modified graphene is obtained by treating carbon materials with coupling agent.

LIAO G, DUAN J

New fluorinated carbonotrithioic acid based binder compounds useful in conductive adhesive of anode sheet to produce secondary battery for battery module of battery pack used in electrical device.

ZHANG M, ZHAO Y, LIN J, LI X, JIN H, YANJI J, JIANGHUI L, ZHU J H

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K