国家/地区 法国（5）
IPC部 C（5）
IPC大类 C08（5）
IPC小类 C08K（5）
IPC C08K003/04（3） B82Y030/00（2） C08K007/24（2）
H01B001/24（2）
发明人
公开年 2022（2）
申请年 2022（2） 
专利权人

Hot melt adhesive composition for encapsulating electronic devices, preferably located under bonnet of vehicle or in medical devices comprises at least one aliphatic semi-crystalline copolyamide and at least one thermally conductive filler.

PRENVEILLE T

Solid polymer conductive composite used for non-metallic aircraft fuel delivery system component, is prepared from composition comprising polyaryletherketone polymer, conductive filler, and dispersing and processing additive.

MAPKAR J A, SALUNKE N, DEMUTH M J

Electromagnetic material for inductance operating at cryogenic temperatures, comprises metal nanoparticles in electrically insulating matrix, where matrix is polymer, metal oxide, or graphene oxide and particles comprise iron, cobalt, nickel, or alloy of these metals.

VIALA B, BERNARD V

Polymeric composition used in e.g. device for measuring brain waves, comprises polymer matrix in which are dispersed carbon nanotubes and adsorbent elements comprising activated carbon particles and graphene nanoplates.

SOULET D B Q, MERCIER H, SOULET DE BRUGIERE Q

Preparing dispersion of graphene particles/sheets in liquid medium comprises providing bar/block of solid material made of graphite, rubbing material on substrate surface and dipping substrate in medium and subjecting medium to ultrasound.

JANOWSKA I, BEGIN D, CHIZARI K, ERSEN O, BERNHARDT P, ROMERO T, LEDOUX M, PHAMHUU CUONG, PHAM H C, PHAMHUU C