国家/地区 日本（3）
IPC部 C（3）
IPC大类 C08（3）
IPC小类 C08K（3）
IPC C08K003/04（3） C08L063/00（2）
发明人
公开年 2013（2）
申请年 2012（3）
专利权人

Manufacture of graphene used for manufacture of graphene junction, involves applying load to aggregated-form graphite particles, such that interlayer bonding of all graphite crystals of aggregated-form graphite particles is destroyed.

KOBAYASHI H

Insulating layer composition for use in substrate of insulating prepreg or insulating film and printed circuit board, comprises soluble type liquid crystal thermosetting oligomer, metal alkoxide compound, and graphene oxide.

JI S Y, HAM S J, KIM S H, KIM D Y, YEONG J S, JIN H S, HWAN K S, YEONG K D, CHI S, KIM S, KIM D, HAM S, CHI S Y, HAMSUKJIN

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S