国家/地区 韩国（3）
IPC部 C（3）
IPC大类 C08（3）
IPC小类 C08L（3）
IPC C09D201/00（3）
发明人
公开年
申请年
专利权人

Electromagnetic shield for electromagnetic interference shielding devices and materials, comprises substrate, conductive additive, and binder incorporated with the conductive additive and deposited on the substrate.

KANER R B, ELKADY M F, KAVANAUGH J, LAINE S, LKADIMACHEREF, JACK K

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Transparent electrode used for electronic device e.g. flat panel display, has layer containing thermosetting copolymer and/or combination of polymers, and layer containing graphene, and layer having electroconductive metal nanowire.

PARK H C, CHO Y, YANG D, KWAK C, KIM K, SHIN W, WOO Y S