国家/地区 台湾（6）
IPC部 B（6）
IPC大类 C08（6）
IPC小类 C09D（6）
IPC B82Y030/00（4） C08K003/04（4） B33Y070/10（2）
B82Y040/00（2） C09D007/62（2） C09D011/102（2）
C09D011/52（2） C09D201/00（2）
发明人
公开年 2021（3） 2022（3）
申请年 2021（6）
专利权人

Matter composition comprises epoxy functionalized two-dimensional shaped particles comprising functionalized graphene, clays, and alumina platelets, carbon nanotubes, epoxy resin, and curing agent comprising ionic liquid, and 1-ethyl-3-methylimidazolium dicyanamide.

KALB J, IFTIME G, WEI J, PANDEY R, RAHULPANDY, JUNHUA W, JAMIKALB

Coated substrate used for electronic device, comprises substrate comprising a metal or metal alloy, basecoat layer on substrate, where basecoat layer comprises pigment particles and one-part thermally cured polymeric resin, and anti-fingerprint topcoat layer on basecoat layer.

WU K, LI Y, CHANG C H, ZHU X

Composition for use in manufacture of in-mold electronic component, e.g. light emitting diode, comprises resin composition, and plastic composition.

CHAKI N K, SHAH C P, SINGH B, RAUT R, KAUSHIK V S, PANDHER R, NAGARAJAN N, KUMAR S M, RUSTOGI A, M S K, KAUSIK B, PANDER R, NAGARAZAN N, RUSTOGGI A

Coating insulation component in high temperature, high voltage and/or corrosive environments, by applying coating of heat processing composition of crosslinkable aromatic polymer to exterior surface of insulation component and crosslinking.

DRAKE K A, SONG L, GAVLIK R, GABRIEL R

Aqueous carbon material dispersion liquid for forming film, comprises carbon material, water and dispersing agent containing polymer having structural unit derived from alkylene group-containing monomer and other copolymerizable monomer.

SHIMANAKA H, KAMABAYASHI J, MURAKAMI Y, DOI S, SATO S, HIROYUKI S, JUN K, YOSHIKAZU M, SEIJI D, YUZURU S, MURAKAMI K, SATO Y

Dispersion useful for manufacturing additive for encapsulating electronic components, comprises portion of cross-linkable moiety, and oxidized discrete carbon nanotubes with bonded dispersing agent.

IVANOVA O, LOWDER S, SWOGGER K W, BOSNYAK C P