国家/地区 中国（7）
IPC部 C（7）
IPC大类 C01（7）
IPC小类 C01B（7）
IPC C01B032/168（7）
发明人
公开年 2021（2） 2022（2）
申请年 2021（3） 
专利权人

Preparation of composite heat dissipation film material for compact electronic device, involves placing carbon nanotube film in furnace, reacting with carbon source udner action of high temperature and plasma radio frequency to obtain graphene nanosheets and covering on carbon nanotube film.

XU J, GONG X

Improving water dispersibility of conductive carbon powder, involves exposing conductive carbon powder to plasma jet or reacting with plasma-treated reaction gas.

SEOK D C, JUNG Y H, YOO S R, JEONG Y H, YOO S Y, RYU S, ZHENG R, SHI D

Carbon nanotube base film material prepared at atmospheric pressure comprises carbon nanotube in the surface of carbon nanotube base film material arranged with orientation.

WU N, ZENG Z

Hollow particles used for heat-dissipation fluid composition, comprise inorganic particle layer comprising ceramic particles and conductive carbon-based particles as spherical hollow particles and having empty inner space inside, and polymer coating layer.

KWON K A, CHUN M S, KIM D Y, SEOK C M, KIM D, QUAN W, QUAN J

Oriented carbon nanotube/graphene composite thermal conductive film comprises carbon nanotube layer and graphene layer compounded on the surface of the carbon nanotube layer.

YAO Y, ZHU Z, ZHANG K, LI L

Vertically aligned carbon nanotube array and graphene composite film material for use in electronic device heat dissipation fields, comprises graphene and vertically oriented carbon nanotube array that is uniformly distributed graphene.

YUAN G, XIE J, SHAN B, LI H, TIAN Y

Applying a coating composition on substrate comprises preparing a coating by mixing carbon in form of carbon nanotubes, graphene and/or fullerenes with metal particles and two-dimensionally or selectively applying the coating on substrate.

ADLER U, RODE D, BURESCH I, WANG J, FRECKMANN D, SCHMIDT H, ROHDE D, WANG Y