国家/地区 中国（6） 美国（2）
IPC部 C（7）
IPC大类 C09（7）
IPC小类 C25D（7） C09D（4） B82Y（3）
C01B（3） C09K（3） F28F（2）
IPC C25D003/38（7）
发明人 CHEN W（2） ZHOU M（2）
公开年 2019（2） 2020（2） 2022（2）
申请年 2019（3） 
专利权人 SHANDONG XIT.（2）

Heat-conducting graphene sheet filling hole copper-covering structure for use in electronic radiating field, has heat conducting graphene sheet whose upper and lower surfaces are uniformly coated with copper layer.

LIU Y, HUANG K, QIN F, WEI T

Layered composite material used as heat conducting material comprises graphene layer and metal copper layer.

HU W, DENG Y, QIN Z, CHEN J, WU Z

Plating layer structure for rolling plating antique copper comprises metal substrate, copper plating layer, antique copper coloring layer and graphene sealing layer orderly prepared from inside to outside on metal substrate.

GUO C, CHEN M, LAI H

Forming electroplated copper on surface of non-metal materials by graphene-based plating ink involves preparing graphene-based plating ink, spraying plating ink on surface of non-metal material and drying ink sprayed on surface.

KU K, CHANG K, LAI C

Micro-channel radiator used to condition air, comprises graphene heat-dissipating coating coated on surface of fin of radiator and containing electro-treated graphene, silicon oxide nanofiber material and nano copper particles.

CHEN W, ZHOU M

Graphene heat dissipation coating comprises electrically treating graphene, silicon oxide nanofiber material and nano copper particles, nano copper particles are deposited by electrodeposition in composite material formed.

CHEN W, ZHOU M

Graphene film used in an electrode is obtainable by epitaxially growing metal layer on surface of substrate, peeling off the metal layer, and depositing graphene onto surface of metal layer.

WODTKE A, YU H K, ALEC W, HAK KI Y, YU H, YUK H K, YUK H