国家/地区 中国（3） 美国（3）
IPC部 C（5）
IPC大类 C09（5）
IPC小类 F28F（5） C09K（4） F28D（4）
C08J（2） C08K（2） C08L（2）
C09D（2）
IPC F28F021/00（5）
发明人 JANG B Z（2） XIONG W（2） ZHAMU A（2）
公开年
申请年
专利权人 NANOTEK INST.（2）

Heat exchanger useful in chemical industry, light industry, energy, pharmacy, mechanical and industrial fields, comprises compartment rotatably connected to housing through central rotor and heat exchange element arranged in compartment.

WANG S, ZHANG F, WEI J, QIN Y, SUN G, LI D

Base material used for core carrier, is obtained by mixing graphene-coated metal material with modifier chosen from polyethylene, polyvinylidene fluoride, and polyurethane, and wetting film to obtain porous thermal conductive film material.

QIN L, LIANG P, ZHI L, ZHAN Z, CHI S, WANG L, ZHU H

Thermally conductive composite material used in electronic device e.g. CPU, comprises unitary graphene matrix material which is single crystal or polycrystalline, and contains chemically bonded graphene molecules or merged graphene planes.

ZHAMU A, XIONG W, JANG B Z, LIN Y

Graphene dispersant used in e.g. preparation of graphene composite powder, and graphene composite film, comprises polyaniline oligomer or derivative which is electroactive polymer, and combines with graphene via pi-pi bond.

DAI L, GU L, YU H, ZHENG Y, MA J, ZHAO H, LIU S, DING J

Integrated heat sink used in electronic device e.g. battery, camera unit comprises unitary graphene material article composed of heat collection member and heat dissipation member integral to the heat collection member.

ZHAMU A, WANG M, XIONG W, JANG B Z, YIJUN L