国家/地区 中国（5） 台湾（3） 世界知识产权组织（3） 日本（2） 韩国（2）
IPC部 C（5）
IPC大类 C09（5）
IPC小类 C09J（5）
IPC C09J011/04（5）
发明人 ICHIKAWA I（2） ISAO I（2） TAKEO Y（2）
YOSHINOBU T（2）
公开年 2022（5）
申请年 2021（4） 
专利权人 LINTEC CORP（2）

Mini light emitting device display module useful in electronic device, comprises light emitting device chip set on one surface of printed circuit board and second adhesive layer has uniform light effect and arranged to cover light emitting device chip and first adhesive layer.

DING C, WANG C, XIA J, XU X, ZHENG P, ZHOU C, LI X, YANG G

Thermally conductive adhesive film useful for organic solar cells in solar cell module, comprises spacer layer or at least one thermally conductive adhesive layer, where spacer layer attached to surface of thermally conductive adhesive layer.

CAI S, JIAO H

Adhesive film used in adhesive film with support sheet, comprises thermally conductive filler having two-dimensional crystal structure epoxy component, curing agent, binder polymer and curing agents has pi-conjugated mesogen skeleton.

ISAO I, TAKEO Y, ICHIKAWA I, YOSHINOBU T

Adhesive film for producing structure e.g. heat-dissipating substrate, is formed of adhesive resin composition that contains thermally conductive filler composed of at least one of graphene having two-dimensional structure and single-walled boron nitride, thermosetting component and binder polymer.

ISAO I, TAKEO Y, ICHIKAWA I, YOSHINOBU T

Electroconductive composition used as interconnection material, contains resin component containing functionalized polybutadiene, electroconductive filler, curative, core-shell rubber toughener, epoxy reactive diluents and curing agent.

ESTRUGA ORTIGA M, HENCKENS A, ESTRUGA O M, ESTRUGAORTIGAMARQUE